Etching a substrate: processes – Forming or treating electrical conductor article
Reexamination Certificate
2006-11-21
2006-11-21
Vinh, Lan (Department: 1765)
Etching a substrate: processes
Forming or treating electrical conductor article
C216S014000, C216S018000, C216S102000, C216S105000
Reexamination Certificate
active
07138064
ABSTRACT:
The present invention relates to a method of manufacturing a semiconductor device. In the method, an etching-back layer consisting of aluminum or copper is formed on a base substrate and a multilayer wiring board is manufactured on the etching-back layer. After that the etching-back layer is etched to be removed under the condition that the multilayer wiring board and the base substrate are not etched, so that the base substrate is separated from the multilayer wiring board. Accordingly, the base substrate can be reused.
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Wolf et al., Silicon Processing for the VLSI Era, 1986, Lattice Press, vol. 1, pp. 520-521.
Muirhead & Saturnelli LLC
NEC Electronics Corporation
Vinh Lan
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