Semiconductor device and method of manufacturing the same,...

Details Semiconductor device and method of manufacturing the same,... Semiconductor device and method of manufacturing the same,...

2006-11-21

2006-11-21

Pert, Evan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257SE25023

Reexamination Certificate

active

07138710

ABSTRACT:
A semiconductor device includes a semiconductor substrate in which an integrated circuit is formed, a through-hole electrode which is formed through first and second surfaces of the semiconductor substrate and includes a first projecting section which projects from the first surface and a second projecting section which projects from the second surface, and an insulating layer which is formed in a region around the second projecting section except a part of the second surface so as to extend outward beyond an outer edge of the first projecting section.

REFERENCES:
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patent: 6620731 (2003-09-01), Farnworth et al.
patent: 6809421 (2004-10-01), Hayasaka et al.
patent: 2001/0013653 (2001-08-01), Shoji
patent: 2002/0017710 (2002-02-01), Kurashima et al.
patent: 2002/0145191 (2002-10-01), Murayama et al.
patent: 2002/0185306 (2002-12-01), Mitani et al.
patent: 2003/0080408 (2003-05-01), Farnworth et al.
patent: 2003/0111721 (2003-06-01), Nakanishi et al.
patent: A 2001-127242 (2001-05-01), None

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