Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2006-11-14
2006-11-14
Lebentritt, Michael (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S110000, C438S114000, C438S612000, C438S618000
Reexamination Certificate
active
07135354
ABSTRACT:
A resin layer is formed on a semiconductor substrate in which a plurality of integrated circuits are formed. In the surface of the resin layer, a plurality of recesses are formed. On the resin layer, an interconnecting line is formed to pass along any of the recesses. The semiconductor substrate is cut into a plurality of semiconductor chips. Each recess is formed to have an opening width less than the thickness of the interconnecting line, and a depth of at least 1 μm.
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Communication from European Patent Office re: related application.
Communication from Korean Patent Office regarding counterpart application.
Communication from Korean Patent Office re: related application.
Harness & Dickey & Pierce P.L.C.
Lebentritt Michael
Lee Cheung
Seiko Epson Corporation
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