Semiconductor device and method of manufacturing the same,...

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Mesa formation

Reexamination Certificate

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C438S042000, C438S700000, C438S109000, C438S656000, C438S114000, C438S754000, C438S462000, C438S657000, C438S756000, C438S465000, C438S667000, C438S459000, C438S757000, C438S597000, C438S684000, C438S691000, C438S759000, C438S614000, C438S685000, C438S692000, C438S959000, C438S653000, C438S687000, C438S696000, C438S977000, C438S654000

Reexamination Certificate

active

07029937

ABSTRACT:
A depression is formed from a first surface of a semiconductor substrate. An insulating layer is provided on the bottom surface and an inner wall surface of the depression. A conductive portion is provided inside the insulating layer. A second surface of the semiconductor substrate is etched by a first etchant having characteristics such that the etching amount with respect to the semiconductor substrate is greater than the etching amount with respect to the insulating layer, and the conductive portion is caused to project while covered by the insulating layer. At least a portion of the insulating layer formed on the bottom surface of the depression is etched with a second etchant having characteristics such that at least the insulating layer is etched without forming a residue on the conductive portion, to expose the conductive portion.

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