Semiconductor device and method of manufacturing the same,...

Details Semiconductor device and method of manufacturing the same,... Semiconductor device and method of manufacturing the same,...

2005-06-14

2005-06-14

Chaudhari, Chandra (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C438S615000

Reexamination Certificate

active

06905915

ABSTRACT:
A method of manufacturing a semiconductor device includes mounting of a semiconductor chip on a substrate. In the mounting step, electrodes of the semiconductor chip and leads formed on the substrate are disposed to face each other. Each of the electrodes has a bump including a soldering or brazing material in at least part of a bonding section bonded to corresponding one of the leads. After providing an insulating material around the electrodes and leads, the soldering or brazing material is melted, and the electrodes are respectively bonded to the leads.

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