Semiconductor device and method of manufacturing the same,...

Details Semiconductor device and method of manufacturing the same,... Semiconductor device and method of manufacturing the same,...

2005-06-21

2005-06-21

Pert, Evan (Department: 2826)

Semiconductor device manufacturing: process

With measuring or testing

Optical characteristic sensed

C250S491100

Reexamination Certificate

active

06908776

ABSTRACT:
A method of manufacturing a semiconductor device comprising the steps of: preparing a flexible substrate which includes a base substrate having a light transmission property and an interconnecting pattern formed on one surface of the base substrate, the flexible substrate allowing a light to pass through a region other than the interconnecting pattern; recognizing a position of the interconnecting pattern by viewing the flexible substrate from a surface opposite to the surface on which the interconnecting pattern is formed through the base substrate; recognizing positions of electrodes formed on a semiconductor chip from a direction identical to that in recognizing the interconnecting pattern; and aligning the interconnecting pattern with the electrodes to connect the flexible substrate to the semiconductor chip by the face down bonding.

REFERENCES:
patent: 6278193 (2001-08-01), Coico et al.
patent: 6395124 (2002-05-01), Oxman et al.
patent: 55-166935 (1980-12-01), None
patent: 08-070013 (1996-03-01), None
patent: 10-123176 (1998-05-01), None
Ken Gilleo, Polymer Thick Film, 1996, Van Norstrand Reinhold, A division of International Thomson Publishing, Inc., pp. 363-373.

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