Semiconductor device and method of manufacturing the same,...

Details Semiconductor device and method of manufacturing the same,... Semiconductor device and method of manufacturing the same,...

2005-05-24

2005-05-24

Parekh, Nitin (Department: 2811)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S127000, C438S108000, C257S783000, C257S787000, C257S790000

Reexamination Certificate

active

06897094

ABSTRACT:
A semiconductor chip is adhered to a substrate by using an adhesive, and a sealant is provided around the semiconductor chip, on a surface of the substrate on which the semiconductor chip is mounted. The adhesive is provided to reach a side surface of the semiconductor chip. The sealant is provided in a manner to expose an upper surface of the semiconductor chip and a part of the adhesive.

REFERENCES:
patent: 6429372 (2002-08-01), Taguchi et al.
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patent: 06-349893 (1994-12-01), None
patent: 08-236586 (1996-09-01), None
patent: 2000-176967 (2000-06-01), None
patent: 2000-311968 (2000-11-01), None
patent: 2001-223230 (2001-08-01), None
patent: 2001-326304 (2001-11-01), None
patent: 2002-026244 (2002-01-01), None

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