Semiconductor device and method of manufacturing the same,...

Details Semiconductor device and method of manufacturing the same,... Semiconductor device and method of manufacturing the same,...

2005-07-26

2005-07-26

Johnson, Jonathan (Department: 1725)

Metal fusion bonding

Process

Plural joints

C228S110100

Reexamination Certificate

active

06921016

ABSTRACT:
A tip of a wire is bonded to a first electrode by using a tool. The wire is drawn from the first electrode to a bump on a second electrode. Apart of the wire is bonded to the center of the bump or a portion of the bump beyond the center in a drawing direction of the wire by using a part of the tool on a first electrode side in the drawing direction of the wire.

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patent: A-2002-280410 (2002-09-01), None
U.S. Appl. No. 10/327,968, filed Dec. 26, 2002, Tomimatsu.
U.S. Appl. No. 10/347,299, filed Jan. 21, 2003, Takahashi et al.
U.S. Appl. No. 10/347,947, filed Jan. 21, 2003, Takahashi.

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