Semiconductor device and method of manufacturing the same

Details Semiconductor device and method of manufacturing the same Semiconductor device and method of manufacturing the same

1996-07-24

2000-09-19

Graybill, David E.

Fishing, trapping, and vermin destroying

438112, 438123, 438126, 438108, H01L 2120

Patent

active

061203017

ABSTRACT:
In the BGA in which the bonding portions of the support frame bonded to the wiring substrate via adhesive layer are molded by a resin, the areas of the bonding portions are each selected to be from 0.5 to 3.1 mm.sup.2. Furthermore, holes are formed in the substrate under the frame corresponding to the bonding portions.

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