Semiconductor device and method of manufacturing the same

Details Semiconductor device and method of manufacturing the same Semiconductor device and method of manufacturing the same

1992-11-02

1994-08-16

Thomas, Tom

Fishing, trapping, and vermin destroying

437211, 437214, 437217, 437220, H01L 2160

Patent

active

053387040

ABSTRACT:
A conductive adhesive such as gold paste is coated and solidified on a lead provided on a frame for manufacture. Wire bonding between a semiconductor chip bonded to the frame and the lead provided thereon is effected between the semiconductor chip and a conductive adhesive layer solidified on the lead. It is thus possible to dispense with a conventional step of plating the frame (with gold) for effecting the wire bonding. In addition, it is possible to obtain reliable wire bonding irrespective of the kind of the base material of the frame or the surface roughness thereof. Further, it is possible to extremely simplify the process on the frame and save gold or like expensive material used as a plating material. Thus, it is possible to extremely reduce the cost of semiconductor device manufacture.

REFERENCES:
patent: 4209358 (1980-06-01), Dileo et al.
patent: 4707724 (1987-11-01), Suzuki et al.
patent: 4835120 (1989-05-01), Mallik et al.
patent: 5045151 (1991-09-01), Edell
patent: 5205036 (1993-04-01), Yamazaki

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