Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent
1998-12-08
1999-12-07
Picardat, Kevin M.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
438111, 438123, 257675, 257712, 257706, 257707, H01L 2144
Patent
active
059982411
ABSTRACT:
A semiconductor device includes a tape carrier, a semiconductor chip, a metal heat spreader, a support ring, and a projection, recess, and spot welding portion. The tape carrier includes a TAB tape. The semiconductor chip is mounted on the tape carrier. The metal heat spreader is fixed to a surface of the semiconductor chip opposite to the tape carrier to dissipate heat generated in the semiconductor chip. The heat spreader has a shape larger than that of the semiconductor chip. The support ring is arranged between the heat spreader and tape carrier and is adhered to the tape carrier. The support ring serves to ensure a predetermined gap between the heat spreader and the tape carrier and to prevent warp of the tape carrier. The projection, recess, and spot welding portion bond the heat spreader and reinforcing member to each other by employing one of mechanical engagement and fusion welding. A method of manufacturing a semiconductor device is also disclosed.
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NEC Corporation
Picardat Kevin M.
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