Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent
1993-11-17
1995-07-25
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
257781, H01L 2348, H01L 2946, H01L 2963, H01L 2964
Patent
active
054365031
ABSTRACT:
The top surface of an insulating substrate is formed with a plurality of electrodes for bump connection, while the undersurface of the insulating substrate is formed with external terminals which are arranged in an array. On the insulating substrate is provided a semiconductor chip. The undersurface of the semiconductor chip is formed with bump electrodes. The electrodes for bump connection are electrically connected to the bump electrodes by means of a conductive adhesive. The space between the semiconductor chip and the insulating substrate is filled with a resin which integrates the above two and dissipates heat generated from the semiconductor chip.
REFERENCES:
patent: 4604644 (1986-08-01), Beckham et al.
patent: 4970575 (1990-11-01), Soga et al.
patent: 5001542 (1991-03-01), Tsukagashi et al.
patent: 5128746 (1992-07-01), Pennisi et al.
patent: 5136365 (1992-08-01), Pennisi et al.
patent: 5194930 (1993-03-01), Papathomas et al.
Kitayama Yoshifumi
Kunitomo Yoshinobu
Nakatani Seiichi
Nozu Makoto
Saeki Keiji
Clark S. V.
Crane Sara W.
Matsushita Electronics Corporation
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