Semiconductor device and method of manufacturing the same

Details Semiconductor device and method of manufacturing the same Semiconductor device and method of manufacturing the same

2008-07-29

2008-07-29

Doan, Theresa T (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S678000, C257S687000, C438S106000, C438S123000

Reexamination Certificate

active

07405469

ABSTRACT:
A semiconductor chip is sealed by resin without covering an outer terminal of a semiconductor device having a power transistor. A semiconductor chip having a power transistor is housed within a recess of a metal cap while a drain electrode on a first surface of the semiconductor chip is bonded to a bottom of the recess via a connection material. A gate electrode and a source electrode are formed on a second surface opposite to the first surface of the semiconductor chip, and the gate electrode and the source electrode are bonded with metal plate terminals6G,6S via connection materials5b, 5c. In addition, the semiconductor chip is sealed by a resin sealing body with mounting-surfaces of the metal plate terminals6G,6S being exposed. Mounting surfaces of the metal plate terminals6G,6S and a third part of the metal cap are bonded to electrodes on a mounting board10via connection materials5e, 5fand5g.

REFERENCES:
patent: 5477611 (1995-12-01), Sweis et al.
patent: 6163069 (2000-12-01), Oohira et al.
patent: 6670718 (2003-12-01), Chinda et al.
patent: 7157308 (2007-01-01), Takano
patent: 2006/0270106 (2006-11-01), Chiu et al.
patent: 2003-051513 (2003-02-01), None
patent: 2004-500720 (2004-01-01), None

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