Semiconductor device and method of manufacturing the same

Details Semiconductor device and method of manufacturing the same Semiconductor device and method of manufacturing the same

2011-08-02

2011-08-02

Landau, Matthew C (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S796000, C257S712000, C257SE23102, C257S713000, C438S124000

Reexamination Certificate

active

07989947

ABSTRACT:
A semiconductor device includes a semiconductor element1, a thermal conductor91located opposite a major surface of the semiconductor element1, and a mold resin member6molding the semiconductor element1and at least a part of the thermal conductor91, wherein at least a part of a top surface of the thermal conductor91has an exposed portion exposed from the mold resin member6, the exposed portion of the thermal conductor91has an opening11, and a periphery of the opening11forms a projecting portion91bprojecting toward an opposite side of the semiconductor element1.

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patent: 2005/0104164 (2005-05-01), Awujoola et al.
patent: 2005/0285258 (2005-12-01), Chen et al.
patent: 2007/0200225 (2007-08-01), Ibrahim et al.
patent: 2008/0079144 (2008-04-01), Tang et al.
patent: 8-139223 (1996-05-01), None

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