Semiconductor device and method of manufacturing the same

Details Semiconductor device and method of manufacturing the same Semiconductor device and method of manufacturing the same

2011-04-19

2011-04-19

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S777000, C257SE25006, C257SE25013, C257SE25021, C257SE25027, C257SE23085

Reexamination Certificate

active

07928551

ABSTRACT:
In a semiconductor device, a first semiconductor chip is stacked on a wiring substrate and has first electrode pads disposed at predetermined positions on an upper surface thereof. A second semiconductor chip is stacked on the first semiconductor chip through an insulating member in an offset manner so that the first electrode pads are exposed. Support members support a back surface of a protruding portion of the second semiconductor chip through the insulating member.

REFERENCES:
patent: 6353263 (2002-03-01), Dotta et al.
patent: 2005/0156323 (2005-07-01), Tokunaga
patent: 2007/0182021 (2007-08-01), Bauer et al.
patent: 2009/0057864 (2009-03-01), Choi et al.
patent: 2000-299431 (2000-10-01), None
patent: 2002-261233 (2002-09-01), None
patent: 2005-197491 (2005-07-01), None

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