Semiconductor device and method of manufacturing the same

Details Semiconductor device and method of manufacturing the same Semiconductor device and method of manufacturing the same

2011-01-18

2011-01-18

Tran, Long K (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S678000, C257S774000, C257S795000, C257SE23004, C257SE23070, C257SE23124

Reexamination Certificate

active

07872360

ABSTRACT:
A semiconductor device is disclosed that includes a wiring board having a via formed therein; a semiconductor element provided on the wiring board; a resist layer covering a surface of the wiring board, the resist layer having an opening in a part thereof positioned on the via; and a sealing resin covering the surface of the via in the opening and the resist layer, and sealing the semiconductor device.

REFERENCES:
patent: 2002/0084538 (2002-07-01), James et al.
patent: 2004/0078964 (2004-04-01), Itou et al.
patent: 09-082835 (1997-03-01), None
patent: 9-326544 (1997-12-01), None
patent: 2000-124344 (2000-04-01), None
patent: 2005-322659 (2005-11-01), None
Korean Office Action dated Mar. 26, 2010, issued in corresponding Korean Patent Application No. 10-2008-0023744.
Korean Office Action dated Jan. 26, 2010, issued in corresponding Korean Patent Application No. 10-2008-0023744.
Chinese Office Action dated May 22, 2009, issued in corresponding Chinese Patent Application No. 200810083671.3.

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