Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1995-04-28
1997-04-22
Ball, Michael W.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156150, 156292, 264259, 427 96, 427261, B32B 712, B29C 6554, H01L 2158, H05K 332
Patent
active
056225903
ABSTRACT:
The top surface of an insulating substrate is formed with a plurality of electrodes for bump connection, while the undersurface of the insulating substrate is formed with external terminals which are arranged in an array. On the insulating substrate is provided a semiconductor chip. The undersurface of the semiconductor chip is formed with bump electrodes. The electrodes for bump connection are electrically connected to the bump electrodes by means of a conductive adhesive. The space between the semiconductor chip and the insulating substrate is filled with a resin which integrates the above two and dissipates heat generated from the semiconductor chip.
REFERENCES:
patent: 5118370 (1992-06-01), Ozawa
BPA (Technology & Mangement) Ltd., Compass programme, Technology/Market Update 5-1990, pp. 5-14 May 1990.
Hong H. Lee, "Fundamentals of Microelectronics Processing", McGraw-Hill, 1990, p. 474 1990.
Kitayama Yoshifumi
Kunitomo Yoshinobu
Nakatani Seiichi
Nozu Makoto
Saeki Keiji
Ball Michael W.
Lorin Francis J.
Matsushita Electronics Corporation
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