Semiconductor device and method of manufacturing the device

Details Semiconductor device and method of manufacturing the device Semiconductor device and method of manufacturing the device

2006-08-29

2006-08-29

Zarneke, David (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S112000, C438S111000, C257S692000, C257S666000

Reexamination Certificate

active

07098081

ABSTRACT:
Cut faces15ato15hare formed on the front end faces13ato13hof the exposed portions12ato12hof respective lead terminals11ato11hof a semiconductor device100,and plating for increasing the solderability is provided on the cut faces15ato15h.

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