Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Patent
1999-01-14
2000-05-30
Picardat, Kevin M.
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
257675, 257690, 257796, H01L 2328
Patent
active
060694084
ABSTRACT:
A method of manufacturing a semiconductor device includes the steps of: mounting a semiconductor chip on a holding board having electrode accommodation recesses formed thereon, and mounting electrode members to the electrode accommodation recesses, the electrode members being formed separately from the semiconductor element; electrically connecting electrode pads formed on the semiconductor chip with the electrode members; forming a resin package for sealing the semiconductor chip on the holding board by using a die, the holding board serving as a part of the die; and separating the resin package including the electrode members from the holding board. A semiconductor device includes: a semiconductor chip; a resin package for sealing the semiconductor chip; electrode members which are embedded in and held by the resin package and which are partly exposed from a mounting surface so as to form external connection terminals; and connecting parts electrically connecting electrode pads on the semiconductor chip with the electrode members.
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Honda Toshiyuki
Oku Akihiro
Tsuji Kazuto
Watanabe Takanori
Yoneda Yoshiyuki
Fujitsu Limited
Picardat Kevin M.
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