Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate
2007-02-13
2007-02-13
Parker, Kenneth (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Ball or nail head type contact, lead, or bond
C257SE23054, C257S678000, C257S787000, C257S700000, C438S124000, C438S106000
Reexamination Certificate
active
10510591
ABSTRACT:
In an example embodiment, the semiconductor device comprises a carrier and a semiconductor element, such as an integrated circuit. The carrier is provided with apertures, thereby defining connecting conductors having side faces. Notches are present in the side faces. The semiconductor element is enclosed in an encapsulation that extends into the notches in the carrier. As a result, the encapsulation is mechanically anchored in the carrier. The semiconductor device can be made in a process wherein, after the encapsulating step, no lithographic steps are necessary.
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Kloen Hendrik Klaas
Steenbruggen Gerardus Henricus Franciscus Willebrordus
Van De Water Peter Wilhelmus Maria
Chu Chris
NXP B.V.
Parker Kenneth
Zawilski Peter
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