Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2011-05-17
2011-05-17
Nguyen, Cuong Q (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S726000, C257S723000, C257S712000, C257S717000, C257S690000, C257S691000, C257S787000, C257S728000, C257S719000, C257S713000, C257SE23010
Reexamination Certificate
active
07944042
ABSTRACT:
A semiconductor device includes an outer resin case having a peripheral wall and terminal mounting holes formed in the peripheral wall, and a layer assembly provided in the outer resin case. The layer assembly includes a semiconductor chip, an insulating circuit board on which the semiconductor chip is mounted, and a heat-dissipating metal base. External terminals having leg portions are arranged in mounting holes of the peripheral wall, and are press-fitted into the terminal-mounting holes. Bonding wires connect the terminal leg portions and a conductive pattern of the insulating circuit board or the semiconductor chip.
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Chino Masaaki
Maruyama Rikihiro
Mochizuki Eiji
Nishizawa Tatsuo
Sugiyama Tomonobu
Fuji Electric Device Technology Co. Ltd.
Kanesaka Manabu
Nguyen Cuong Q
Tran Trang Q
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