Semiconductor device and method of manufacturing same

Details Semiconductor device and method of manufacturing same Semiconductor device and method of manufacturing same

1997-03-04

1999-09-14

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257676, 257784, H01L 23495

Patent

active

059527102

ABSTRACT:
Of ends of a plurality of inner leads disposed around a semiconductor chip shaped substantially in the form of a rectangle, the ends of the inner leads, which correspond to the corners of the rectangle, are provided so as to approach in the direction of the semiconductor chip. Owing to the provision referred to above, bonding wires for connecting electrical connections between the semiconductor chip and the ends of the inner leads can be prevented from drifting upon a mold process.

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