Semiconductor device and method of manufacturing a...

Details Semiconductor device and method of manufacturing a... Semiconductor device and method of manufacturing a...

2007-09-25

2007-09-25

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S666000, C257S750000, C257SE23037

Reexamination Certificate

active

11180636

ABSTRACT:
There is provided a semiconductor device including, a bed, a brazing filler metal formed on a first surface of the bed, a barrier metal film formed on a first surface of the brazing filler metal, a alloy film formed on a first surface of the barrier metal film, a semiconductor chip disposed on a first surface of the alloy film, a bonding wire electrically connecting between a terminal formed on a first surface of the semiconductor chip and a lead terminal, and a mold resin molding the bed, the brazing filler metal, the barrier metal film, the alloy film, the semiconductor chip and the bonding wire.

REFERENCES:
patent: 5134459 (1992-07-01), Maeda et al.
patent: 5731635 (1998-03-01), Bareither et al.
patent: 5958607 (1999-09-01), Kim et al.
patent: 6140703 (2000-10-01), Cronin et al.
patent: 2003/0134142 (2003-07-01), Ivey et al.
patent: 10-92778 (1998-04-01), None
patent: 2002-270676 (2002-09-01), None
patent: 2004-103919 (2004-04-01), None

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