Semiconductor device and method of manufacturing a...

Details Semiconductor device and method of manufacturing a... Semiconductor device and method of manufacturing a...

2009-05-22

2011-12-06

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S778000, C257S738000, C257SE23068

Reexamination Certificate

active

08072069

ABSTRACT:
A semiconductor device includes at least a wiring board, a semiconductor chip that is mounted on one face side of the wiring board, connection pads that are formed on the one face side of the wiring board, and connect through bonding wires to electrode pads on the semiconductor chip, and bumps disposed on another face side of the wiring board; the semiconductor chip is disposed such that four chip sides face corners of the wiring board, and each chip corner is near one of the outer peripheral sides of the wiring board; and, on one face of the wiring board are provided corner regions which are enclosed by the chip sides of the semiconductor chip and the corners of the wiring board, and the connection pads are disposed in these corner regions.

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