Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Reexamination Certificate
2008-07-22
2008-07-22
Sefer, A. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With semiconductor element forming part
C257S777000, C257S686000, C257S778000, C257SE21499, C257SE23061
Reexamination Certificate
active
11366123
ABSTRACT:
The present invention provides a semiconductor device that is inexpensive and can suppress signal transmission delay, and a manufacturing method thereof. The semiconductor device includes: a plurality of semiconductor chips; a semiconductor substrate that has, on the same surface thereof, a chip-to-chip interconnection for electrically connecting the plurality of semiconductor chips to each other, and a plurality of chip-connection pads connected to the chip-to-chip interconnection; and a wiring board that has a plurality of lands of which pitch is larger than a pitch of the chip-connection pads, wherein a major surface of each of the plurality of semiconductor chips is connected to the chip-connection pads via a first connector so that the plurality of semiconductor chips are mounted on the semiconductor substrate, and an external-connection pad is formed on the major surface other than a region facing the semiconductor substrate, and is connected to the land on the wiring board via a second connector.
REFERENCES:
patent: 7198980 (2007-04-01), Jiang et al.
patent: 08-250653 (1996-09-01), None
patent: 2004-079745 (2004-03-01), None
Hatano Masaki
Takaoka Yuji
Sefer A.
Sony Corporation
Wilson Scott R
LandOfFree
Semiconductor device and method of manufacturing... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device and method of manufacturing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and method of manufacturing... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3935042