Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate
2011-02-01
2011-02-01
Clark, S. V (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
C438S126000
Reexamination Certificate
active
07880317
ABSTRACT:
A semiconductor device is provided in which the heat dissipation characteristic of a flip-chip mounted semiconductor chip is improved. A semiconductor device is provided with a substrate, a semiconductor flip-chip mounted on the substrate, a sealing resin layer for sealing around the semiconductor flip-chip. A sealing resin layer for sealing the semiconductor chip is formed around the semiconductor chip. In this semiconductor device, the back surface of the semiconductor chip is exposed and is convex with respect to the upper surface of the sealing resin layer.
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Adachi Mitsuru
Kanayama Fujio
Kusano Hidetoshi
Niimi Tetsunori
Nishitani Yuji
Clark S. V
Katten Muchin & Rosenman LLP
Sony Computer Entertainment Inc.
Sony Corporation
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