Semiconductor device and method of manufacture thereof

Details Semiconductor device and method of manufacture thereof Semiconductor device and method of manufacture thereof

2005-04-20

2008-10-14

Gandhi, Jayprakash N (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S800000, C361S816000, C165S104330, C165S185000

Reexamination Certificate

active

07436672

ABSTRACT:
A transfer mold type power module (“TPM”) is provided with a projection at each of the four corners on its front main surface. The TPM is also provided a first screw hole at its center. A shielding plate is provided with a second crew hole in a position that corresponds to the first screw hole. A control substrate is provided with third screw holes in positions that correspond to the projections. The shielding plate and the TPM are joined by putting a first screw through the first and second screw holes and temporarily fastening the tip of the first screw by a temporary fastening member at the rear main surface of the TPM. The control substrate and the TPM are joined by second screws via the third screw holes.

REFERENCES:
patent: 5134546 (1992-07-01), Izumi et al.
patent: 5606919 (1997-03-01), Fox et al.
patent: 5793106 (1998-08-01), Yasukawa et al.
patent: 6181590 (2001-01-01), Yamane et al.
patent: 6215679 (2001-04-01), Yamane et al.
patent: 6501167 (2002-12-01), Hanamura
patent: 6509629 (2003-01-01), Yoshimatsu et al.
patent: 6646884 (2003-11-01), Frisch et al.
patent: 6700191 (2004-03-01), Schmid et al.
patent: 6703699 (2004-03-01), Kawaguchi
patent: 6762937 (2004-07-01), Kimoto et al.
patent: 6822850 (2004-11-01), Pfeifer et al.
patent: 6822865 (2004-11-01), Balszunat et al.
patent: 6900986 (2005-05-01), Kimoto et al.
patent: 6903457 (2005-06-01), Nakajima et al.
patent: 6956742 (2005-10-01), Pfeifer et al.
patent: 7190070 (2007-03-01), Manz et al.
patent: 2005/0051874 (2005-03-01), Ushijima
patent: 2001-250890 (2001-09-01), None

Affiliated with

Also associated with

Rating

Semiconductor device and method of manufacture thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and method of manufacture thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and method of manufacture thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4015903