Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2007-04-03
2007-04-03
Zarneke, David A. (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S127000, C257SE21503, C257SE21511
Reexamination Certificate
active
11272698
ABSTRACT:
A method of manufacturing a semiconductor device includes (a) interposing an adhesive between a surface of a substrate on which an interconnect pattern is formed and a surface of a semiconductor chip on which electrodes are formed; and (b) applying pressure between the semiconductor chip and the substrate, and covering with the adhesive at least a part of lateral surfaces of the semiconductor chip that is perpendicular to the surface of the semiconductor chip on which the electrodes are formed.
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English Abstract and Computer-Generated English Translation of previously submitted reference JP-A-10-116855.
Oliff & Berridg,e PLC
Seiko Epson Corporation
Zarneke David A.
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