Semiconductor device manufacturing: process – Chemical etching
Reexamination Certificate
2006-01-24
2006-01-24
Jackson, Jerome (Department: 2815)
Semiconductor device manufacturing: process
Chemical etching
C438S658000, C438S688000, C257S758000, C257S773000, C257S774000
Reexamination Certificate
active
06989330
ABSTRACT:
In order to form an aluminum system wiring that does not peel off on an insulating film containing fluorine and to improve the reliability thereof, a semiconductor device according to the present invention includes an insulating film (14) containing fluorine formed on a substrate (11), a titanium aluminum alloy film (17a) formed on the insulating film (14) containing fluorine, and a metallic film (17b) comprising aluminum or an aluminum alloy formed on the titanium aluminum alloy film (17a).
REFERENCES:
patent: 5614439 (1997-03-01), Murooka et al.
patent: 5644166 (1997-07-01), Honeycutt et al.
patent: 5700383 (1997-12-01), Feller et al.
patent: 5990011 (1999-11-01), McTeer
patent: 6150272 (2000-11-01), Liu et al.
patent: 6281584 (2001-08-01), Ngo
patent: 2002/0109235 (2002-08-01), Leiphart
patent: 10-098102 (1998-04-01), None
patent: 11-345876 (1999-12-01), None
patent: 2000-208622 (2000-07-01), None
patent: 2000-286262 (2000-10-01), None
patent: 2001-144180 (2001-07-01), None
patent: 2001-210647 (2001-08-01), None
patent: 2001-284448 (2001-10-01), None
Enomoto Yoshiyuki
Kanamura Ryuichi
Fenty Jesse A.
Jackson Jerome
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