Semiconductor device and method of manufacture thereof,...

Details Semiconductor device and method of manufacture thereof,... Semiconductor device and method of manufacture thereof,...

2005-01-25

2005-01-25

Tokar, Michael (Department: 2829)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S613000

Reexamination Certificate

active

06846699

ABSTRACT:
A method of manufacturing a semiconductor device comprises a step of mounting a semiconductor chip on a wiring substrate having a base substrate on which are formed interconnecting lines; while melting the base substrate, bumps provided to the semiconductor chip are pressed in, and the bumps are electrically connected to the interconnecting lines.

REFERENCES:
patent: 6051093 (2000-04-01), Tsukahara
patent: 6208525 (2001-03-01), Imasu et al.
patent: 20010031515 (2001-10-01), Miyasaka

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