Semiconductor device and method of manufacture therefor

Metal working – Method of mechanical manufacture – Assembling or joining

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29588, 29590, 357 73, B01J 1700

Patent

active

039436217

ABSTRACT:
A semiconductor device and method of manufacture therefor includes the establishment of at least one PN junction in a semiconductor chip through conventional techniques. Electrical contacts are formed. The entire semiconductor device is coated with a passivant coating having a first layer of low temperature silicon dioxide and a second layer of glass, the second layer of glass being applied in two steps.

REFERENCES:
patent: 3542550 (1970-11-01), Conrad
patent: 3571913 (1971-03-01), Bodway
patent: 3673679 (1972-07-01), Carbojal
patent: 3689392 (1972-09-01), Sandera
patent: 3697334 (1972-10-01), Yamamoto
patent: 3728784 (1973-04-01), Schmidt
patent: 3755720 (1973-08-01), Kern

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