Semiconductor device and method of manufacture

Details Semiconductor device and method of manufacture Semiconductor device and method of manufacture

1997-09-17

2000-08-15

Potter, Roy

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

438107, 438108, 438113, H01L 2120

Patent

active

061035483

ABSTRACT:
A semiconductor device includes a substrate (10) that can be cut into different sizes. A plurality of wirebond fingers (12) are formed on a top surface (13) of the substrate (10). The plurality of wirebond fingers (12) are located within concentric interconnect regions (23, 25, 27, 29, 31, 33, 35) and electrically connected to a via (14) by a signal interconnect line (11). The size of substrate (10) can be altered by cutting the substrate (10) to remove any of the interconnect regions (23, 25, 27, 29, 31, 33, 35). A semiconductor component (44) attached to the top side (13) of the substrate (10) can have a die pad (48) wirebonded to any of the plurality of wirebond fingers (12) located along the signal interconnect line (11) for connection to the via (14).

REFERENCES:
patent: 5397917 (1995-03-01), Ommen et al.
patent: 5691568 (1997-11-01), Chou et al.

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