Semiconductor device and method of making

Details Semiconductor device and method of making Semiconductor device and method of making

1994-12-14

1999-07-06

Niebling, John

Fishing, trapping, and vermin destroying

437974, 437228, H01L 21302

Patent

active

059197137

ABSTRACT:
A method for fabricating a semiconductor device including the steps of forming a plurality of semiconductor chips on a semiconductor substrate, forming a connection part such that the connection part connects the semiconductor chips with each other across a dicing line, bonding the semiconductor substrate upon a support substrate, removing the dicing region while maintaining the semiconductor chips in a state such that the semiconductor chips are bonded upon the support substrate, detaching the plurality of semiconductor chips from the support substrate while maintaining an alignment between the semiconductor chips, and separating the semiconductor chips from each other by eliminating the connection part.

REFERENCES:
patent: 4961821 (1990-10-01), Drake et al.
patent: 5041190 (1991-08-01), Drake et al.
patent: 5136354 (1992-08-01), Morita et al.
patent: 5393706 (1995-02-01), Mignardi et al.
patent: 5434094 (1995-07-01), Kobiki et al.
patent: 5482887 (1996-01-01), Duinkerken et al.

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