Semiconductor device and method of formation

Single-crystal – oriented-crystal – and epitaxy growth processes; – Processes of growth from solid or gel state – Using heat

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117 9, 117 10, 437 21, 437 61, 437228, C30B 102

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054451078

ABSTRACT:
A silicon-on insulator film (38) is formed by solid phase epitaxial re-growth. A layer of amorphous silicon (36) is formed such that it is only in direct contact with an underlying portion of a silicon substrate (12). The layer of amorphous silicon (36) is subsequently annealed to form a monocrystalline layer of epitaxial silicon (38). Because the amorphous silicon layer (36) is in contact with only the silicon substrate (12), during the re-growth process, the resulting epitaxial layer (38) is formed with a reduced number of crystal defects. The resulting epitaxial silicon layer (38) may then be used to form semiconductor devices.

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Schubert et al., "Confined Lateral Selective Epitaxial Growth of Silicon . . . ," IEEE Electron Device Letters, vol. 11, No. 5, May 1990, pp. 181-183.
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