Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2006-05-16
2006-05-16
Gurley, Lynne A. (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S113000, C438S114000, C438S118000, C438S458000, C438S460000, C438S462000, C438S464000, C438S465000, C438S598000, C438S599000
Reexamination Certificate
active
07045392
ABSTRACT:
A method of fabricating a semiconductor device comprises the steps of: preparing a tape carrier10on which is formed lines of a plurality of bonding portions14across the width thereof, in a pattern that repeats along the length thereof, and winding the tape carrier10on a reel24; providing an anisotropic conductive film30on at least the bonding portions14; mounting a surface36having electrodes34of semiconductor chips32on the anisotropic conductive film30; applying pressure to the semiconductor chips32in the direction of the bonding portions14, to connect the bonding portions14electrically to the electrodes34; forming external electrodes38in the tape carrier10; and punching out the tape carrier10into individual units for each semiconductor chip32.
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English language Abstract & computer generated translation of JP 10-084014, (Mar. 31, 1998).
Gurley Lynne A.
Oliff & Berridg,e PLC
Seiko Epson Corporation
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