Semiconductor device and method of fabrication thereof,...

Details Semiconductor device and method of fabrication thereof,... Semiconductor device and method of fabrication thereof,...

2006-07-04

2006-07-04

Thai, Luan (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S432000, C257S434000, C257S686000, C257S723000

Reexamination Certificate

active

07071567

ABSTRACT:
A semiconductor device includes: a substrate on which is formed an interconnecting pattern; a first semiconductor chip provided above the substrate and having a first electrode on a surface facing the substrate; and a second semiconductor chip provided above the first semiconductor chip and having a second electrode on a surface facing the substrate. The substrate has a bent portion inclined from the first electrode to the second electrode. The interconnecting pattern extends along the bent portion and electrically connected to the first and second electrodes.

REFERENCES:
patent: 6147401 (2000-11-01), Solberg
patent: 6486544 (2002-11-01), Hashimoto
patent: 6576992 (2003-06-01), Cady et al.
patent: 6727431 (2004-04-01), Hashimoto
patent: 6765236 (2004-07-01), Sakurai
patent: 6765288 (2004-07-01), Damberg
patent: 04-028260 (1992-01-01), None

Affiliated with

Also associated with

Rating

Semiconductor device and method of fabrication thereof,... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and method of fabrication thereof,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and method of fabrication thereof,... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3561413