Semiconductor device and method of fabrication thereof

Fishing – trapping – and vermin destroying

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437 52, 437235, 437919, 148DIG14, 148DIG163, H01L 2170

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052799859

ABSTRACT:
The present invention relates to a semiconductor device and a method of fabrication of the same, said semiconductor device including a capacitive structure comprising of a lower layer electrode consisting of a silicon material, a capacitive insulating film consisting of a tantalum oxide film and an upper layer electrode, said upper layer electrode comprising at least a titanium nitride film for covering said capacitive insulating film. Said method of fabrication comprises the steps of: forming the lower layer electrode; forming the capacitive insulating film for covering said lower layer electrode; and forming the titanium nitride film for covering said capacitive insulating film.

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patent: 5006481 (1991-04-01), Chan et al.
patent: 5045494 (1991-09-01), Choi et al.
patent: 5079191 (1992-01-01), Shinriki et al.
patent: 5108941 (1992-04-01), Paterson et al.
Shinriki et al, "UV-O.sub.3 and Dry-O.sub.2 : Two-Step Annealed Chemical Vapor-Deposited Ta.sub.2 O.sub.5 Films for Storage Dielectrics of 64-Mb DRAM's", IEEE Transactions on Electron Devices, vol. 38, pp. 455-462, No. 3, Mar. 1991.

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