Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Patent
1997-08-18
2000-05-30
Whitehad, Jr., Carl
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
257113, 257118, H01L 2306
Patent
active
060690267
ABSTRACT:
This invention relates to the fabrication and assembly of semiconductor chips, substrates, and modules, and more particularly to methods and apparatus for achieving flexible, low-cost manufacturing. Commercial and military systems today are placing increasing demands on flexible application and reliable operation, as well as on simplified manufacturing.
REFERENCES:
patent: 5478781 (1995-12-01), Bertin et al.
patent: 5585665 (1996-12-01), Anjoh et al.
patent: 5606198 (1997-02-01), Ono et al.
patent: 5786628 (1998-07-01), Beilstein, Jr. et al.
Archer Judith Sultenfuss
Terrill Robert E.
Honeycutt Gary C.
Navarro Arthur I.
Potter Roy
Texas Instruments Incorporated
Whitehad, Jr. Carl
LandOfFree
Semiconductor device and method of fabrication does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device and method of fabrication, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and method of fabrication will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1909454