Semiconductor device and method of fabricating the same

Details Semiconductor device and method of fabricating the same Semiconductor device and method of fabricating the same

2007-10-29

2010-06-08

Everhart, Caridad M (Department: 2895)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S109000, C257S684000, C257SE21661, C257SE21499

Reexamination Certificate

active

07732257

ABSTRACT:
A semiconductor device and a fabricating method thereof are provided. The semiconductor device can include a first chip having transistors of only the NMOS type, a second chip having transistors of only the PMOS type, and an interconnection electrically connecting the first and second chips to each other. By forming NMOS and PMOS transistors on separate chips, the total number of implant photo processes can be decreased, thereby reducing the fabrication cost.

REFERENCES:
patent: 6404648 (2002-06-01), Slupe et al.
patent: 6853571 (2005-02-01), Doller
patent: 7138295 (2006-11-01), Leedy
patent: 7164113 (2007-01-01), Inokuma et al.
patent: 2007/0145367 (2007-06-01), Chen et al.
patent: 05-175445 (1993-07-01), None
patent: 10-1996-0013909 (1999-06-01), None
patent: 10-2003-0048852 (2005-01-01), None

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