Semiconductor device and method of fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Charge transfer device

Reexamination Certificate

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C257S278000

Reexamination Certificate

active

07449733

ABSTRACT:
A semiconductor device includes a semiconductor substrate, a channel region formed above the semiconductor substrate, a first gate electrode formed above the channel region via a first gate insulating film, a second gate electrode formed below the channel region via a second gate insulating film to face the first gate electrode, a first insulating film covering side surfaces of the second gate electrode, a second insulating film covering a bottom surface of the second gate electrode, and a semiconductor layer which has an upper surface positioned above an upper surface of the first gate insulating film and side surfaces facing side surfaces of the first gate electrode, and in which a source region and drain region are formed. The side surfaces of the second gate electrode are aligned with or positioned inside the side surfaces of the semiconductor layer.

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S. Harrison et al., “Highly Performant Double Gate MOSFET Realized with SON Process,” International Electron Devices Meeting (IEDM), Technical Digest, 2003, 18.6, pp. 449-452.
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H.S. Philip Wong, “Novel Device Options for Sub-100 nm CMOS,” 1999 IEDM Short Course, pp. 1-63.

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