Semiconductor device and method of fabricating the same

Details Semiconductor device and method of fabricating the same Semiconductor device and method of fabricating the same

2006-05-16

2006-05-16

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S777000, C257S723000, C257S778000, C257S737000, C257S738000, C257S774000

Reexamination Certificate

active

07045886

ABSTRACT:
A semiconductor device is disclosed which has a first substrate with wiring formed thereon, a second substrate mounted above the first substrate with a conductive plug buried in the second substrate to penetrate between upper and lower surfaces thereof, a plurality of semiconductor chips mounted above the second substrate and having a terminal electrode as electrically connected to the first substrate through the conductive plug of the second substrate, and a resin buried in an empty space or gap between adjacent ones of the plurality of semiconductor chips.

REFERENCES:
patent: 5870289 (1999-02-01), Tokuda et al.
patent: 6335565 (2002-01-01), Miyamoto et al.
patent: 2001-094033 (2001-04-01), None

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