Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2011-03-22
2011-03-22
Nguyen, Dao H (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S678000, C257S691000, C257S698000, C257S787000, C257S791000, C257SE21499, C257SE23004, C257SE23062, C257SE23069, C257SE23178, C438S106000, C438S108000, C438S112000, C438S118000, C438S612000
Reexamination Certificate
active
07911047
ABSTRACT:
A semiconductor device includes: a package substrate that includes a recessed portion, with electrode pads that are electrically connected to electrodes of the semiconductor chip being formed inside the recessed portion; a semiconductor chip that is housed in the recessed portion; terminal-use wires that are formed on the surface of the package substrate and are electrically connected to the electrode pads; external connection pads that are formed on a back surface of the package substrate and are electrically connected to the electrode pads; a sealing resin portion that includes a grinded surface that is parallel to the surface of the package substrate, and seals at least the semiconductor chip by a sealing resin; rewiring pads that are formed on the grinded surface; and connecting wires that are formed on the grinded surface and electrically interconnect the terminal-use wires and the rewiring pads.
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Hasegawa Hidenori
Takahashi Norio
Nguyen Dao H
Oki Semiconductor Co., Ltd.
Rabin & Berdo PC
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