Semiconductor device and method of fabricating semiconductor...

Details Semiconductor device and method of fabricating semiconductor... Semiconductor device and method of fabricating semiconductor...

2008-10-14

2010-12-28

Purvis, Sue (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S787000, C257SE23010, C257SE21214, C438S460000

Reexamination Certificate

active

07859097

ABSTRACT:
A semiconductor device including a semiconductor chip having external connecting terminals formed on one side is restrained to cause chipping in ridge line portion of semiconductor chip. A cover layer103is formed on the other side of the semiconductor chip102. At least a part of an end portion106of the cover layer is outside of the ridge line portion107of the semiconductor chip.

REFERENCES:
patent: 5708304 (1998-01-01), Tomita
patent: 7250354 (2007-07-01), Uchida
patent: 2001/0033016 (2001-10-01), Sumikawa et al.
patent: 2006/0049488 (2006-03-01), Uchida
patent: 2006/0249853 (2006-11-01), Sumikawa et al.
patent: 2007/0108636 (2007-05-01), Andoh
patent: 2007/0278678 (2007-12-01), Uchida
patent: 2001-230224 (2001-08-01), None
patent: 2006-80284 (2006-03-01), None

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