Semiconductor device and method of assembly

Details Semiconductor device and method of assembly Semiconductor device and method of assembly

2011-06-07

2011-06-07

Quach, Tuan N. (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S784000, C257S787000, C257SE21499, C257SE25016, C438S107000, C438S118000

Reexamination Certificate

active

07956459

ABSTRACT:
An encapsulated leadless semiconductor package comprises a first semiconductor die and a second semiconductor die which are electrically connected by a bond wire. The lower surface of the first semiconductor die and the lower surface of the second semiconductor die are essentially coplanar with the lower surface of the encapsulation material.

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