Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2006-10-24
2006-10-24
Brewster, William M. (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S124000, C438S126000, C438S692000
Reexamination Certificate
active
07125751
ABSTRACT:
Disclosed is a semiconductor device which comprises a semiconductor element having a plurality of electrodes, a plurality of external electrodes disposed around the periphery of the semiconductor element, a fine wire electrically connected between at least one of surfaces of each of the plural external electrodes and at least one of the plural electrodes of the semiconductor element, and an encapsulating resin which encapsulates the semiconductor element, the plural external electrodes, and the fine wires and whose external shape is a rectangular parallelepiped, wherein a bottom surface of the semiconductor element and a bottom surface of each of the plural external electrode are exposed from a bottom surface of the encapsulating resin and a top surface of the semiconductor element and a top surface of each of the plural external electrode are located substantially coplanar with each other.
REFERENCES:
patent: 4722765 (1988-02-01), Ambros et al.
patent: 4961105 (1990-10-01), Yamamoto
patent: 5656550 (1997-08-01), Tsuji et al.
patent: 6084291 (2000-07-01), Fujimori
patent: 6247229 (2001-06-01), Glenn
patent: 6291271 (2001-09-01), Lee et al.
patent: 6326299 (2001-12-01), Homma et al.
patent: 6395580 (2002-05-01), Tseng
patent: 2002/0105069 (2002-08-01), Kawahara et al.
patent: 11-186301 (1999-07-01), None
patent: 11-195733 (1999-07-01), None
Fujimoto Hiroaki
Hamatani Tsuyoshi
Nomura Toru
Brewster William M.
Matsushita Electric - Industrial Co., Ltd.
Nixon & Peabody LLP
Studebaker Donald R.
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