Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2005-12-20
2005-12-20
Picardat, Kevin M. (Department: 2822)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S110000, C438S121000, C438S124000
Reexamination Certificate
active
06977190
ABSTRACT:
A semiconductor device provided with a shallow metal basin having a flange outwardly extending from the top edge of the side wall of the shallow metal basin, to receive a semiconductor device chip having one or more semiconductor device elements disposed therein and one or more bonding pads arranged thereon, an insulator frame having one or more external terminals arranged thereon, the external terminals being connected with the bonding pads, and the insulator frame being arranged on the flange of the shallow metal basin, and a plastic layer molded to cover the semiconductor device chip, resultantly realizing a semiconductor device packaged in a chip scale package of which the production procedure is simplified and the heat dissipation efficiency and the integration are remarkably improved.
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Oki Electric Industry Co. Ltd.
Picardat Kevin M.
Rabin & Berdo P.C.
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