Semiconductor device manufacturing: process – Semiconductor substrate dicing – With attachment to temporary support or carrier
Reexamination Certificate
2006-08-15
2006-08-15
Geyer, Scott B. (Department: 2812)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
With attachment to temporary support or carrier
C438S113000
Reexamination Certificate
active
07091109
ABSTRACT:
A protective sheet is fixed to a jig, and regions of the protective sheet corresponding to regions where dicing-cut is to be performed are removed to form grooves. Then, a semiconductor wafer is bonded to the protective sheet at an opposite side of the jig, and the jig is detached from the protective sheet and the semiconductor wafer bonded together. After that, the semiconductor wafer is cut into semiconductor chips by dicing along the grooves of the protective sheet. Because the protective sheet is not cut by dicing, no scraps of the protective sheet is produced, thereby preventing contamination to the chips.
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Fujii Tetsuo
Inomata Sumitomo
Muto Hiroshi
Yoshihara Shinji
Denso Corporation
Geyer Scott B.
Posz Law Group , PLC
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