Semiconductor device and method for producing the same

Details Semiconductor device and method for producing the same Semiconductor device and method for producing the same

2007-07-24

2007-07-24

Pert, Evan (Department: 2826)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S026000, C257S099000, C257S777000, C257SE33056, C257SE33057, C257SE23023

Reexamination Certificate

active

10819873

ABSTRACT:
A method for producing a semiconductor device of the present invention includes forming a surface electrode on a semiconductor element, forming a solder layer by plating on one principal surface of the surface electrode, mounting the semiconductor element on the sub-mount so that the solder layer contacts a principal surface of the sub-mount, and bonding the sub-mount and the semiconductor element to each other via the solder layer.

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