Semiconductor device and method for producing the same

Details Semiconductor device and method for producing the same Semiconductor device and method for producing the same

2008-06-03

2008-06-03

Ho, Tu-Tu V (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257SE23070, C257S741000, C257S748000, C257S773000, C257S786000

Reexamination Certificate

active

07382050

ABSTRACT:
A semiconductor device includes a tape carrier substrate having a flexible insulating film base, a plurality of conductor wirings provided on the film base, and wiring bumps respectively formed so as to cover an upper surface and both side surfaces of the conductor wirings, and a semiconductor chip mounted on the tape carrier substrate, wherein electrodes of the semiconductor chip are connected to the conductor wirings via the wiring bumps. Electrode bumps are formed on the electrodes of the semiconductor chip, the electrodes of the semiconductor chip are connected to the conductor wirings via a bonding between the wiring bumps and the electrode bumps, and the electrode bumps are harder than the wiring bumps. This structure can reduce bonding damages to the electrodes of the semiconductor chip caused by a process of connecting the electrodes and the conductor wirings via the bumps.

REFERENCES:
patent: 2002/0000672 (2002-01-01), Mori
patent: 2002/0008528 (2002-01-01), Sato et al.
patent: 2002/0024110 (2002-02-01), Iwatsu et al.
patent: 2003/0089923 (2003-05-01), Oida et al.
patent: 2004/0212969 (2004-10-01), Imamura et al.
patent: 2002-43376 (2002-02-01), None
patent: 2003-31613 (2003-01-01), None
patent: 2004-327936 (2004-11-01), None
Japanese Office Action from the corresponding JP 2006-036929, mailed Jan. 8, 2008.

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