Semiconductor device and method for producing the same

Details Semiconductor device and method for producing the same Semiconductor device and method for producing the same

1997-11-25

1999-04-20

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438123, H01L 2144

Patent

active

058952349

ABSTRACT:
A semiconductor device which is greatly reliable and is also advantageous in high-density mounting, as well as the method for producing the semiconductor device, includes a filmy material placed along the peripheral sides of the semiconductor chip and along one surface of the semiconductor chip. The conductor pattern is provided on the filmy material such that one end of the pattern is connected to the corresponding electrode which has been provided on the other surface of the semiconductor chip and the other end is opposed to the back of the semiconductor chip. Hereby a semiconductor device can be realized which is greatly reliable and is also advantageous for high-density mounting. Besides, the semiconductor device is produced in such a way that a cutting and bending process of each lead and the film tape is performed toward the tape carrier package, so that the other end of each lead is opposed to the back of the semiconductor chip, holding the film tape between them. Hereby a method can be realized for producing a semiconductor device which is greatly reliable and is also advantageous for high-density mounting.

REFERENCES:
patent: 5130780 (1992-07-01), Kumai et al.
patent: 5397916 (1995-03-01), Normington
patent: 5470796 (1995-11-01), Tsukada et al.
patent: 5616953 (1997-04-01), King et al.

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